Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar
Elizabeth Bekker, Georg Gramlich, Luca Valenziano, Lucas Giroto de Oliveira, Theresa Antes, Thomas Zwick, Akanksha Bhutani
A system-in-package for a wideband digital radar, in D-band, requires broadband, high-gain antennas combined with broadband chip-to-package and package-to-printed circuit board (PCB) interconnects. This paper demonstrates a wideband, low-loss quasi-coaxial signal transition, and a novel electric split ring resonator (eSRR)-based antenna-in-package (AiP) with a modified reflector concept, for impro