EuMC: Design, Packaging and Reliability Aspects of RF MEMS Circuits Fabricated Using a GaAs MMIC Foundry Process Technology
R. Malmqvist, C. Samuelsson, W. Simon, P. Rantakari, D. Smith, Manu Lahdes, Markku Lahti, T. Vaha-Heikkila, J. Varis, R. Baggen
Proceedings of the 40th European Microwave Conference
Design, Packaging and Reliability Aspects of RF MEMS Circuits Fabricated Using a GaAs MMIC Foundry Process Technology
R. Malmqvist#1, C. Samuelsson#2, W. Simon*3, P. Rantakari4, D. Smith£5, Manu Lahdes6, Markku Lahti7, T. Vähä-Heikkilä8, J. Varis9, and R. Baggen*10
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FOI Swedish Defence Research Agency, Olaus Magnus väg 42, SE-58330 Linköping