EuMC: A Multi Crossing Wire Bonding Technique for High Power Transistor Packages
Jongsik Lim, Seongmin Oh, Yongho Lee, Jakyung Koo, Yongchae Jeong, Dal Ahn
Proceedings of the 39th European Microwave Conference
A Multi Crossing Wire Bonding Technique for High Power Transistor Packages
Jongsik Lim1, Seongmin Oh2, Yongho Lee2, Jakyung Koo1, Yongchae Jeong3, and Dal Ahn1
Dept. of Electrical and Comm. Eng., SoonChunHyang Univ., Asan, Chungnam, Rep. Of Korea 2 RFHIC Inc., Suwon, Gyeonggi, Rep. Of Korea 3 Dept. of Electronic and Information Eng., Chonbuk N