Proceedings of the 3rd European Microwave Integrated Circuits Conference On-Chip S-Shaped Rat-Race Balun for Millimeter-Wave Band Using Wafer-Level Chip-Size Package Process Chiaki Inui, Yasuo Manzawa, and Minoru Fujishima School of Frontier Sciences, The University of Tokyo 7-3-1 Hongo, Tokyo, 113-8656, Japan {chiaki,yasuo,fuji}-rfic.t.u-tokyo.ac.jp Abstract-- In millimeter-wave CMOS circuits, a

Proceedings of the 3rd European Microwave Integrated Circuits Conference A 20GS/s 8-Bit Current Steering DAC in 0.25µm SiGe BiCMOS Technology Samiran Halder1, Hans Gustat1, Christoph Scheytt1, Andreas Thiede2 Department of Circuit Design, IHP Microelectronics 25, Im Technologiepark, 15236 Frankfurt (Oder), Germany halder-ihp-microelectronics.com gustat-ihp-microelectronics.com 1 Chair for High-F

Proceedings of the 3rd European Microwave Integrated Circuits Conference Development of Ultrahigh-Speed InP/GaAsSb/InP DHBTs: Are Terahertz Bandwidth Transistors Realistic? C.R. Bolognesi1, H. Liu, O. Ostinelli, Y. Zeng Institut für Feldtheorie und Höchstfrequenztechnik (IfH), THz Electronics Group, ETH-Zürich, Gloriastrasse 35, Zürich CH-8092, Switzerland 1 colombo-ieee.org Abstract-- In respo

Proceedings of the 3rd European Microwave Integrated Circuits Conference A multi-channel S-band FMCW radar front-end A.P.M. Maas1, F.E. van Vliet2 TNO Defence, Security and Safety, Oude Waalsdorperweg 63, 2597 AK Den Haag, Netherlands 2 noud.maas-tno.nl frank.vanvliet-tno.nl 1 Abstract-- This paper describes the design and performance of a low-cost synthesized FMCW radar module, operating in S

Proceedings of the 3rd European Microwave Integrated Circuits Conference Performance of Unstuck Gate AlGaN/GaN HEMTs on (001) Silicon Substrate at 10 GHz J-C. Gerbedoen #1, A. Soltani1, N. Defrance1, M. Rousseau1, C. Gaquière1, J-C. De jaeger1, S. Joblot2,3, Y.Cordier2 1 IEMN, UMR-CNRS 8520, USTL, Avenue Poincaré, 59652 Villeneuve d'Ascq Cedex, France # Jean-Claude.Gerbedoen-iemn.univ-lille1.fr

Proceedings of the 3rd European Microwave Integrated Circuits Conference 24 GHz LTCC I/Q Mixer Using Packaged HEMTs Veljko Napijalo #1, Vicentiu Cojocaru #2 TDK Electronics Ireland 3022 Lake Drive, City West Business Campus, Dublin 24, Ireland 1 # Napijalo-tdk.de Abstract--An I/Q active mixer in LTCC technology using packaged HEMTs as mixing devices is described. A mixer is designed for use in

Proceedings of the 3rd European Microwave Integrated Circuits Conference Tapped integrated inductors: Modelling and Application in Multi-Band RF Circuits Morin Dehan #1, Jonathan Borremans #*, Piet Wambacq#* Stefaan Decoutere# IMEC Kapeldreef 75, Heverlee, Belgium 1 # morin.dehan-imec.be * Vrije Universiteit Brussel, Department ETRO Pleinlaan, Brussels, Belgium between either kinds of model i

Proceedings of the 3rd European Microwave Integrated Circuits Conference 60 GHz Frequency Conversion 90 nm CMOS Circuits Mikko Kantanen#1, Jan Holmberg#2, Timo Karttaavi¤3, Juha Volotinen*4 # VTT Technical Research Centre of Finland Tietotie 3, FI-02150 Espoo, Finland 1 mikko.kantanen-vtt.fi 3 jan.holmberg-vtt.fi ¤ Nokia Research Centre Itämerenkatu 11-13, FI-00180 Helsinki, Finland 3 timo.ka

Proceedings of the 3rd European Microwave Integrated Circuits Conference New Macromodeling Approach to Phase Noise Analysis of Locked Oscillators M.M. Gourary1, S.G. Rusakov1, S.L. Ulyanov1, M.M. Zharov1, B.J. Mulvaney2, K.K. Gullapalli2 1IPPM, 2 Russian Academy of Sciences, 3 Sovetskaya str., Moscow, Russia gourary-ippm.ru Freescale Semiconductor Inc., 7700 W. Parmer Lane, Austin, Texas, USA b

Proceedings of the 3rd European Microwave Integrated Circuits Conference A Four-Antenna Transceiver MIMIC for 60 GHz Wireless Multimedia Applications S. Koch #1, I. Kallfass *2, A. Leuther *2, M. Schlechtweg *2, S. Saito #1 and M. Uno #3 #1 Sony Deutschland GmbH, Hedelfinger Strasse 61, D-70327 Stuttgart, Germany Email: koch-sony.de *2 Fraunhofer Institute for Applied Solid-State Physics (IAF)