Proceedings of the 38th European Microwave Conference Low Cost Embedded Duplexer Implementation for WiMAX Front-end Module with Multi-layer Organic Substrate KyungO Kim#1, Taeeui Kim#2, Hongwon Kim#3, Dongwhan Lee#4, Sung Yi#5 # SAMSUNG ELECTRO-MECHANICS, Korea kyungo.kim-samsung.com taeeui.kim-samsung.com 3 hongwon.kim-samsung.com 4 arisnova-samsung.com 5 sung.yi-samsung.com 2 1 Abstract-- In

Proceedings of the 38th European Microwave Conference Design and Optimization of Linear and Planar slot Arrays on Rectangular Waveguides Homayoon Oraizi and Mahmoud T. Noghani Department of Electrical Engineering, Iran University of Science and Technology Narmak, Tehran, 16846-13114, Iran h_oraizi-iust.ac.ir and mtalafi-ee.iust.ac.ir Abstract- This paper presents a new method for the design and o

Proceedings of the 38th European Microwave Conference Chip-to-Chip Interconnects Using Integrated Antennas Hristomir Yordanov and Peter Russer Technische Universit¨ t M¨ nchen a u Institute for High-Frequency Engineering Arcisstr. 21, 80333 Munich, Germany yordanov-tum.de Abstract-- In this work we have investigated the possibility to use parts of the CMOS integrated circuit ground planes as ant

Proceedings of the 38th European Microwave Conference Initial Results of Multielement Antenna Performance in 5.85 GHz Vehicle-to-Vehicle Scenarios Andreas Thiel # , Oliver Klemp #, Delphi Delco Electronics Europe GmbH, TecCenter, 31162 Bad Salzdetfurth, Germany Institut f¨ r Hochfrequenztechnik und Funksysteme, u Leibniz Universit¨ t Hannover, Appelstr. 9A, 30167 Hannover, Germany a Contact: { a

Proceedings of the 38th European Microwave Conference Implementation of an LTCC Quad-band Module for WLAN and WiMAX Applications Dong Ho Kim1*, 2, Dongsu Kim1, Jong In Ryu1, Jun Chul Kim1, Chong Dae Park2, and In Sang Song3 Electronic Materials and Packaging Research Center, Korea Electronics Technology Institute, 68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-816, Korea Electronics Eng

Proceedings of the 38th European Microwave Conference Study on Distance of Interference Sources on Wireless Sensor Network Frank Vanheel#*, Jo Verhaevert# and Ingrid Moerman* # Faculty of Applied Engineering Sciences, University College Ghent Schoonmeersstraat 52, B-9000 Ghent, Belgium frank.vanheel-intec.ugent.be jo.verhaevert-hogent.be * IBBT, Department of Information Technology (INTEC), Gh

Proceedings of the 38th European Microwave Conference Study of Monopole Radiators for Planar Circuit Integration Luis Quineche Orellana, Klaus Solbach1 University Duisburg-Essen, Hochfrequenztechnik, Bismarckstr.81,D-47048, Germany 1 klaus.solbach-uni-due.de Abstract -- Communication terminals for WLAN and similar systems require omni-directional antennas which can be used as a single radiator

Proceedings of the 38th European Microwave Conference Tuning of Barium Strontium Titanate (BST) Thin Film Materials Employing High Resistive Thin Indium Tin Oxide (ITO) Layer Mahmoud Al Ahmad #1 , Sandrine Payan 2 , Dominique Michau # 2 , Mario Maglione 2 , Robert Plana #1 LAAS CNRS 7 avenue du Colonel Roche, Toulouse/France 1 al-ahmad.mahmoud-ieee.org ICMCB CNRS University of Bordeaux

Proceedings of the 38th European Microwave Conference A Miniature Stacked Spiral Inductor Utilizing a Proposed Taper Structure for RFIC Size Reduction Sang-Gyu Park#1, Kwang-Du Lee#2, and Yusin Kim#3 # Wireless Solutions Laboratory, Central Research and Development Institute Samsung Electro-Mechanics Co., Ltd. Suwon, 443-743, South Korea hass.park-samsung.com 2 kwang21-samsung.com 3 yusincall.ki

Proceedings of the 38th European Microwave Conference Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications C. Jiang#1, G. G. Mekonnen*2, V. Krozer#, T. K. Johansen#, H-G. Bach* # Department of Electrical Engineering, Technical University of Denmark Oersteds Plads building 348, Lyngby, 2800, Denmark 1 cj-elektro.dtu.dk * Fraunhofer Institute for Telecommunications, H