EuMC: High-Level Embedded Passive Triplexer and Quintplexer Module into Organic Packaging Substrate
Sung P. Lim, Seong J. Cheon, Dong H. Bang, Jae Yeong Park
Proceedings of the 38th European Microwave Conference
High-Level Embedded Passive Triplexer and Quintplexer Module into Organic Packaging Substrate
Sung P. Lim, Seong J. Cheon, Dong H. Bang, and Jae Y. Park*
Micro/Nano Devices and Packaging Lab., Electronic Engineering, Kwangwoon University 447-1, Wolgye-dong, Nowon-gu, Seoul, 139-701 Korea
lspb71-hotmail.com jaepark-kw.ac.kr Abstract -- In this