PCS Power Amplifier Module Package Using Selectively Anodized Aluminum Substrate
Seong-Ho Shin, Ju-Hyang Lee, Bo-In Sohn, Seung-Han Ryu, Young-Se Kwon
Proceedings of the 36th European Microwave Conference
PCS Power Amplifier Module Package Using Selectively Anodized Aluminum Substrate
Seong-Ho Shin1, Ju-Hyang Lee2, Bo-In Sohn1, Seung-Han Ryu1, and Young-Se Kwon1
2
Dept. of EECS, KAIST, 373-1 Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea Telecommunication Network Business, Samsung Electronics Co., LTD. Suwon, Kyungki-do, Korea structure bas