EuMC: Optimised Thermal and Microwave Packaging for Wide-Band Gap Transistors : Diamond & Flip Chip
Chloe Schaffauser, Olivier Vendier, S. Forestier, F. Michard, D. Geffroy, Claude Drevon, J.F. Villemazet, Jean-Louis Cazaux, S.L. Delage, J.L. Roux
Optimised Thermal and Microwave Packaging for Wide-Band Gap transistors : Diamond & flip chip
C.Schaffauser1, O.Vendier1, S.Forestier1, F.Michard1, D.Geffroy1, C.Drevon1, JF.Villemazet1, JL.Cazaux1, S.Delage2, JL.Roux3
1
Alcatel Space, Microwave Product Department, 26 avenue J.F. Champollion, B.P. 1187, 31037 Toulouse, Cedex 1, France, Tel : 33 (0)5 34 35 46 44, Fax : 33 (0)5 34 35 69 47, Chloe.S