EuMC: Study on Slit Pad Structure to Maintain MMIC Characteristics Both in On-Wafer and On-Package Conditions in Millimeter-Wave Applications
Shin Chaki, Takao Ishida, Yoshihiro Notani, Takeo Mizukoshi, Yoshinobu Sasaki, Makio Komaru
Study on Slit Pad Structure to Maintain MMIC Characteristics Both in On-wafer and On-package Conditions in Millimeter-wave Applications
Shin Chaki1, Takao Ishida1, Yoshihiro Notani1, Takeo Mizukoshi2, Yoshinobu Sasaki1, and Makio Komaru1
1
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