ECWT: Design of a High Speed Digital Interface for Multi-Standard Mobile Transceiver RFIC's in 0.13(mu)m CMOS
Karim Chabrak, F. Bachmann, Gernot Hueber, K. Seemann, Linus Maurer, Z. Boos, Robert Weigel
Design of a High Speed Digital Interface for MultiStandard Mobile Transceiver RFIC's in 0.13µm CMOS
K. Chabrak1, F. Bachmann2, G. Hueber3, K. Seemann1, L. Maurer4, Z. Boos2 and R. Weigel1
1
University of Erlangen-Nuremberg, Institute for Electronics Engineering, Erlangen, Germany, 2 Infineon Technologies, Munich, Germany 3 Institute for Integrated Circuits, Johannes-Kepler-University, Linz, Austr