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A 24.6-GHz MMIC HBT Triple-Push Oscillator
H. Wang, Y. L. Tang
A 24.6-GHz MMIC HBT Triple-Push Oscillator Yu-Lung Tang and Huei Wang Dept. of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, 10617, ROC E-mail: hueiwang-ew.ee.ntu.edu.tw ABSTRACT A triple-push oscillator has been implemented using MMIC approach. This 24.6-GHz MMIC HBT triple-push oscillator was fabricated using InGaP/GaAs HB
Hybrid Dyadic -MPIE Integral Equation Analysis of Passive Microwave Devices in Layered Media
M. Vrancken, G. A. E. Vandenbosch
Hybrid Dyadic - MPIE Integral Equation Analysis of Passive Microwave Devices in Layered Media Mark Vrancken, Guy A. E. Vandenbosch Katholieke Universiteit Leuven Department of Electrical Engineering Division ESAT-TELEMIC Kasteelpark Arenberg 10 B-3001 Heverlee (Leuven), BELGIUM phone +32/(0)16/321820 fax +32/(0)16/321986 Mark.Vrancken-esat.kuleuven.ac.be abstract Integral equation modeling of elec
A New Technique for the Transient Simulation of Transmission Lines Inclusive of Skin Effect
M. Condon
A NEW TECHNIQUE FOR THE TRANSIENT SIMULATION OF TRANSMISSION LINES INCLUSIVE OF SKIN EFFECT M. Condon School of Electronic Engineering Dublin City University Glasnevin Dublin 9 Ireland Phone: +353 1 7005405 Fax: +353 1 7005508 Email: marissa.condon-dcu.ie ABSTRACT A new approach is presented for the transient simulation of lossy transmission lines in high-speed circuits. The approach is based on
The Principle of Symmetry of Kinetic Coefficients for Media with Ferrite Inclusions and its Application to Nonreciprocal Bi-Anisotropic Composites
S. V. Zagriadski, S. A. Tretyakov
THE PRINCIPLE OF SYMMETRY OF KINETIC COEFFICIENTS FOR MEDIA WITH FERRITE INCLUSIONS AND ITS APPLICATION TO NONRECIPROCAL BI-ANISOTROPIC COMPOSITES S.V. Zagriadski1 and S.A. Tretyakov2 Science Technology Center No. 407, Department of Electrical and Computer Engineering Hanyang University, Haengdang-dong 17, Seongdang-Ku, Seoul, 133-791, Korea Fax: +82-2-571-4656, E-mail: zagriadski-ieee.org 2 Radio
Frequency Dependence of HEMT Under Optical Illumination
H. Yajian, A. Alphones
Frequency Dependence of HEMT Under Optical Illumination Huang Yajian* Arokiaswami Alphones, Senior Member IEEE *Department of Electrical Engineering School of Electrical and Electronic Engineering National University of Singapore Nanyang Technological University Singapore, 639798 Singapore, 119260 Abstract-- An analysis of the AC characteristics of AlGaAs/GaAs HEMT under illumination with modulate
Advances in Thin Film Fabrication Techniques for High Volume Optical, Microwave and Millimetre Wave Circuit Applications
K. Callery, P. Lowbridge
Advances in Thin Film Techniques for Optical, Microwave and Millimeter wave Circuit Applications K.Callery & P.Lowbridge 1 2 1. Aeroflex MIC Technology Corporation, 100 Andover By Pass, North Andover, MA 01845, USA Tel 001-978-687-9625 Fax 001-978-687-9721 E-mail: kcallery-mic.aeroflex.com 2. Novacom Microwave Ltd, Unit 6, 22 The Green, Nettleham, Lincoln, LN2 2NR, England, UK Tel +44 1522 751136
New Probing Technology Now Enables Impedance Controlled On-Wafer Probing
M. Wollitzer, S. Thies, S. Schott
New Probing Technology Now Enables Impedance Controlled On-Wafer Probing M. Wollitzer 1), S. Thies 1), S. Schott 2) 1) Rosenberger Hochfrequenztechnik, Hauptstrasse 1, D-83413 Fridolfing, Germany M_Wollitzer-Rosenberger.de / S_Thies-Rosenberger.de 2) Karl Suss Dresden GmbH, Suss-Strasse 1, D-01561 Sacka, Germany sschott-sussdd.de ABSTRACT The development of coaxial and planar RF measurement syste
Thermal Resistance Extraction of Power Transistors using Electric Field Simulation
Y. Zhu, Q. Cai, J. Gerber
THERMAL RESISTANCE EXTRACTION OF POWER TRANSISTORS USING ELECTRIC FIELD SIMULATION Yu Zhu, Qian Cai, and Jason Gerber Ansoft Corp., Elmwood Park, NJ 07407, USA, E-mail: yzhu-comsoft.com ABSTRACT The use of electric field simulation to extract thermal resistance of power transistor for circuit analysis is described. Compared with conventional techniques based on thermal field simulation, our appro
A Novel Proximity Coupled Active Integrated Antenna
LSK
A NOVEL PROXIMITY COUPLED ACTIVE INTEGRATED ANTENNA Sasidhar Vajha*, Member, IEEE, and Prasad Shastry**, Senior Member, IEEE *MMIC Design Engineer, TLC Precision Wafer Tech Inc, 1411, W. River Road N., Minneapolis, MN 55411, USA Tel: +1(612)341-2795, Fax: +1(612)341-2799, Email: svajha-tlcprecision.com **Professor, Dept. of Electrical and Computer Engg., Bradley University, 1501, W. Bradley Ave.,
Sub-Micron CMOS Characterisation for Single Chip Wireless Applications
V. F. Fusco, B. Toner, M. S. Alam, G. A. Armstrong
Sub-Micron CMOS Characterisation for Single Chip Wireless Applications B. Toner, V.F. Fusco, M.S. Alam and G.A. Armstrong The Department of Electrical and Electronic Engineering The Queens University of Belfast, Ashby Building, Stranmillis Road Belfast, N. Ireland, BT9 5AH Tel: (028) 90274089 Fax: (028) 90667023 E-mail: b.toner-ee.qub.ac.uk, v.fusco-ee.qub.ac.uk ABSTRACT This paper describes a mul
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