ELLIPTICALLY POLARIZED LEAKY -WAVE ANTENNA ARRAYS FOR MILLIMETER WAVE J. Modelski*, J. Jarkowski* and E.Yashchyshyn** *Warsaw University of Technology, Institute of Radioelectronics, Nowowiejska 15/19, 00-665 Warszawa, Poland, i.modelski-ire.pw.edu.pl: i.iarkowski-ire.pw.edu.pl State University "Lvivska Polytekhnica", Department of Telecommunication, Bandery 12, ** 290646 Lviv, Ukraine, yashch-pol

IMPLEMENTATION OF AN OUTDOOR FAR-FIELD MEASUREMENT SYSTEM AT IRCTR (INTERNATIONAL RESEARCH CENTRE FOR TELECOMMUNICATIONSTRANSMISSION AND RADAR) P. Aubry, P. Hakkaart, 1. H. Zijderveld, L. P. Ligthart International Research Centre for Telecornmunications- Transmission and Radar Delft University of Technology, Mekelweg 4, 2628 CD Delft, the Netherlands P.Aubry-ITS.TUDelft.nl ABSTRACT The IRCTR has

PIM Characterisation of the ESTEC Compact Test Range A.D.Rawlins, J.S.Petit and S.D.Mitchell The Electronic Engineering Laboratory, University of Kent, Canterbury, Kent, CT2 ?NT, UK e-mail: a.d.rawlins-ukc.ac.uk British Telecom Laboratories, Martlesham Heath, Ipswich, Suffolk, IPS 7RE, UK e-mail: stuart.mitchell-bt-sys.bt.co.uk ABSTRACT This paper describes the measurement of the passive intermo

Experimental Set-up for Measurement of GPR Antenna Radiation Patterns R.V. de Jongh, A. Yarovoy, L.P. Ligthart Delft University of Technology, Faculty ofInformation Technology and Systems International Research Centre for Telecommunications-transmission and Radar (IRCTR) Mekelweg 4, 2628 CD Delft, The Netherlands Phone: +31-15-2782496 Fax: +31-15-2782496 E-mail: R.V.deJongh-et.tudelft.nl Abstract

Experimental assessment and compensation of the interaction between modulated probe arrays and antenna under test in cylindrical rapid near-field measurements A.Ziyyat(l) , D.Picard(2), J.Ch.Bolomey(2) Abstract Rapid near-field measurements can be performed by using a probe array instead of mechanical scanning a single probe. However, among possible objections against using probe arrays, the inte

Modeling and Simulation of Hybrid RF Circuits Using a Versatile Compact Bondwire Model A.G. Harm*, K. Mouthaanco, E. Aziz*, M. Versleijen* *Discrete Semiconductors Nijmegen, Philips Semiconductors, Gerstweg 2, 6534 AE Nijmegen, The Netherlands Lex.Harm-nym.sc. philips. com coDelftInstitute of Microelectronics and Submicron Technology, Feldmannweg 17, 2600GB Delft The Netherlands koen-dutette.et.tu

CHARACTERIZATION OF FLIP CHIP BUMP INTERCONNECTS S. J. Spiegel and A. Madjar RAFAEL 87, P. O. Box. 2250, 31021, Haifa, Israel Tel. 00-9724-8794360 Fax. 00-9724-8792037 ABSTRACT This paper presents lumped elements equivalent circuits for several interconnects between microstrip and CPW transmission lines printed on GaAs and silicon substrates using flip chip technology. The effect of the bump heigh

EuMC.98 Application Oriented Session AN iNDEPTH EVALUATION OF IDGH FREQUENCY CIRCUIT LAMINATES FOR THE WIRELESS TELECOMMUNICATION MARKET Arturo J. Aguayo, Technical Support Manager art.aguayo-rogers-corp.com Rogers Corporation 100 S. Roosevelt Ave Chandler, AZ 85226 USA Tel: 602961-8271 Fax:602961-4533 Abstract Growth in the wireless telecommunication market. An important part to the systems is

Low-Power Si-BJT L-Band Down-Converter Chip Jakub J. Kucera, Martin L. Schmatz and Werner Bachtold ETH ZUrich, Lab. for EM Fields and Microwave Electronics, Gloriastr.35, CH-8092 ZUrich, Switzerland; FAX +41 1 632 11 98; Tel +41 1 6325551 Email: kucera-ifh.ee.ethz.ch Abstract A monolithic L-band down converter consisting of a LNA, a double balanced mixer, a VCO and a prescaler has been fabricated

Systematic Investigation of 3-level Si MCM-D Transformer I Balun Structures for 0.3-10 GHz Wireless Applications under the European TWiCS Program R.H. Jansen, J. Jotzo, Ph.A. Boysen Aachen University of Technology (RWTH), EE Department, Kopernikusstr. 16, D-52074 Aachen, Germany ITHE, G. Kahmen, A. Meyer Jansen Microwave GmbH, Kackertstr. 16-18, D-52072 Aachen, Germany R.G. Arnold, D.J. Pedder