EuMC: High Quality Integrated Inductor in Fan-Out Wafer-Level Packaging Technology for mm-Wave Applications
Kavin Senthil Murugesan, Mykola Chernobryvko, Sherko Zinal, Marco Rossi, Ivan Ndip, Mathias Boettcher, Klaus Dieter Lang, Marcel Wieland, Christian Goetze, Saquib Bin Halim, Jean Trewhella
Proceedings of the 50th European Microwave Conference
High Quality Integrated Inductor in Fan-out
Wafer-Level Packaging Technology for mm-Wave
Applications
Kavin Senthil Murugesan*, Mykola Chernobryvko#, Sherko Zinal#, Marco Rossi#, Ivan Ndip#, Mathias Boettcher#,
Klaus Dieter Lang*#, Marcel Wieland+, Christian Goetze+, Saquib Bin Halim+, Jean Trewhella+
*
Technische Universität Berlin, Germany