SIX DAYS THREE CONFERENCES ONE EXHIBITION EUROPEAN MICROWAVE WEEK 2018 IFEMA - FERIA DE MADRID, MADRID, SPAIN 23RD ? 28TH SEPTEMBER 2018 MICROWAVE WEEK IFEMA FERIA DE M A D R I D, S PA I N 23-28 SEPTEMBER 2018 www.eumweek.com EUROPEAN MICROWAVE WEEK 2018 CONFERENCE PROGRAMME EUROPE?S PREMIER MICROWAVE, RF, WIRELESS AND RADAR EVENT Register online at: www.eumweek.com Official Publication:

Proceedings of the 13th European Microwave Integrated Circuits Conference Innovation Driven by MMIC Technology in the Field of Broadcast Systems Ana Peláez Televes S.A. Santiago de Compostela, Spain apelaez-televes.com purpose, pillar bump technology and flip chip processes come up as the perfect solution. Among the key advantages provided by solder reflow flip chip processes are: size reduction

Proceedings of the 13th European Microwave Integrated Circuits Conference A 110-to-147 GHz Frequency Sixtupler in a 130 nm SiGe BiCMOS Technology Mingquan Bao#1, Zhongxia He*2, Thanh Ngoc Thi Do*3, and Herbert Zirath#*4 # Ericsson Research, Ericsson AB, Sweden Dept. of Microtechnology and Nanoscience, Chalmers University of Technology, Sweden 1 Mingquan.bao-ericsson.com, {2zhongxia, 3tngoc, 4her

Proceedings of the 13th European Microwave Integrated Circuits Conference Variable Gain Distributed Amplifier with Capacitive Division Christian v. Vangerow#1 , Daniel Stracke# , Dietmar Kissinger* , Thomas Zwick# # Institute of Radio Frequency Engineering and Electronics, KIT, Karlsruhe, Germany * IHP, Frankfurt (Oder), Germany 1 christian.vangerow-kit.edu Abstract ? In this work the design of

Proceedings of the 13th European Microwave Integrated Circuits Conference Ensuring Charge Conservation in GaN HEMT Large Signal Model Ciaran Wilson and Justin King School of Electrical and Electronic Engineering University College Dublin Dublin 4, Ireland Email: ciaran.wilson-ucdconnect.ie II. C HARGE C ONSERVATION Abstract?In this paper an experiment has been carried out, in MATLAB, where meas

Proceedings of the 13th European Microwave Integrated Circuits Conference Novel Push-Push Frequency Doubler Concept Soenke Vehring#1 , Georg Boeck*2 # Microwave Engineering, Technische Universit¨at Berlin, Germany * GloMic GmbH, Berlin, Germany 1 s.vehring-tu-berlin.de, 2 g.boeck-glomic.de Abstract ? This paper presents a novel push-push frequency doubler concept which can deliver high balanced

Proceedings of the 13th European Microwave Integrated Circuits Conference A Terahertz Direct Detector in 22nm FD-SOI CMOS Ritesh Jain1 , Robin Zatta1 , Janusz Grzyb1 , David Harame2 , Ullrich R. Pfeiffer 1 IHCT, 1 University of Wuppertal, Germany Dresden, Germany rjain-uni-wuppertal.de 2 GLOBALFOUNDRIES, pW/Hz1/2 respectively for 0.855 THz radiation at a chopping frequency of 3 kHz. The NEP r

Proceedings of the 13th European Microwave Integrated Circuits Conference A Broadband 4 ? 18 GHz Active Quadrature Hybrid Paul Sangaré#1, Christophe Loyez*2, Kevin Carpentier*, Markus Mayer#3, Dirk Hartung#, François Parickmiler#, Nathalie Rolland^ # ARELIS, Zone industrielle de Marville, 55600 Marville, France IEMN, IEMN-UMR 8520, Avenue Poincaré BP 60069, 59652 Villeneuve D'Ascq Cedex, France

Proceedings of the 13th European Microwave Integrated Circuits Conference Sparse model selection of digital predistorters using Subspace Pursuit Juan A. Becerra, Daniel Herrera, Mar´?a J. Madero-Ayora, Carlos Crespo-Cadenas Dept. Signal Theory and Communications, University of Seville, Seville, Spain jabecerra-us.es, danherluq-alum.us.es, mjmadero-us.es, ccrespo-us.es set S, which is defined as

Proceedings of the 13th European Microwave Integrated Circuits Conference DC-170 GHz Characterization of 22nm FDSOI Technology for Radar Sensor Applications M. Sadegh Dadash1, Shai Bonen1, Utku Alakusu1, David Harame2, Sorin P. Voinigescu1 1 ECE, University of Toronto, Toronto, ON, M5S 3G4, Canada 2 GlobalFoundaries, Dresden, Germany Abstract?The high frequency performance of fully wired 22nm F