EuMC: A 20Gbit/s, 280GHz Wireless Transmission in InP-HEMT Based Receiver Module Using Flip-Chip Assembly
Yoichi Kawano, Hiroshi Matsumura, Shoichi Shiba, Masaru Sato, Toshihide Suzuki, Yasuhiro Nakasha, Tsuyoshi Takahashi, Kozo Makiyama, Taisuke Iwai, Naoki Hara
Proceedings of the 45th European Microwave Conference
A 20 Gbit/s, 280 GHz Wireless Transmission in InPHEMT based Receiver Module Using Flip-Chip Assembly
Yoichi Kawano, Hiroshi Matsumura, Shoichi Shiba, Masaru Sato, Toshihide Suzuki, Yasuhiro Nakasha, Tsuyoshi Takahashi, Kozo Makiyama, Taisuke Iwai, and Naoki Hara
Fujitsu Limited, Atsugi, Kanagawa 243-0197, Japan
Abstract-- In this paper, 20 Gbi