EuMC: An Ultra-Wideband, Hybrid, Distributed Power Amplifier Using Flip-Chip Bonded GaN Devices on AlN Substrate
A. Cagri Ulusoy, Christopher Barisich, Spyridon Pavlidis, Wasif T. Khan, John Papapolymerou
Proceedings of the 44th European Microwave Conference
An Ultra-Wideband, Hybrid, Distributed Power Amplifier Using Flip-Chip Bonded GaN Devices on AlN Substrate
A. Ca ri Ulusoy, Christopher Barisich, Spyridon Pavlidis, Wasif T. Khan, and John Papapolymerou ¸ g School of Electrical and Computer Engineering, Georgia Institute of Technology, 777 Atlantic Drive, 30332-0250, Atlanta, GA, e-mail: aculu