Low-cost eWLB packaging for automotive radar MMICs in the 76?81 GHz range
Wolfgang Menzel, Thomas Walter, J. Böck, M. Wojnowski, C. Wagner, H. Knapp, W. Hartner, M. Treml, F. J. Schmückle, S. Sinha, R. Lachner
Embedded wafer-level ball grid array (eWLB) is investigated as a low-cost plastic package for automotive radar applications in the 76?81 GHz range. Low transmission losses from chip to package and board are achieved by appropriate circuit and package design. Special measures are taken to effectively remove the heat from the package and to optimize the package process to achieve automotive quality