EuMC: Embedded IC Module Package Using Silicon Substrate
Jong-Min Yook, Jun Chul Kim, Dongsu Kim, Jong-Chul Park
Proceedings of the 42nd European Microwave Conference
Embedded IC Module Package using Silicon Substrate
Jong-Min Yook, Jun Chul Kim, Dongsu Kim, and Jong-Chul Park
Packaging Research Centre, Korea Electronics Technology Institute, 68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-816, Korea radio-keti.re.kr
Abstract-- In this paper, an embedded passive and active package is developed by u