EuMC: A Silicon Platform with Through-Silicon Vias for Heterogeneous RF 3D Modules
Pierre Bar, Sylvain Joblot, Perceval Coudrain, Jean-Francois Carpentier, B. Reig, Christine Fuchs, Christine Ferrandon, Jean Charbonnier, Henri Sibuet
Proceedings of the 41st European Microwave Conference
A Silicon Platform With Through-Silicon Vias for Heterogeneous RF 3D Modules
Pierre Bar, Sylvain Joblot, Perceval Coudrain, Jean-François Carpentier
STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France
Bruno Reig, Christine Fuchs, Christine Ferrandon, Jean Charbonnier, Henri Sibuet
CEA-LETI/Minatec, 17 rue des Martyrs, 38054 G