EuMC: A High Efficiency, Compact Size, Single Die Tri-Mode PAM for 3G/4G Handset Applications
Cindy Yuen, Duc Chu, Kirk Laursen, Yinyin Zhao, Xiaoming Ji, Heinz Do, Yi-Ching Pao
Proceedings of the 41st European Microwave Conference
A High Efficiency, Compact Size, Single Die Tri-Mode PAM for 3G/4G Handset Applications
Cindy Yuen, Duc Chu, Kirk Laursen, Yinyin Zhao, Xiaoming Ji, Heinz Do, Yi-Ching Pao
Epic Communications, Inc. 1231 Bordeaux Drive Sunnyvale, CA 94089, USA
cyuen-epic.com.tw
Abstract--A set of high level integration, compact size (1.3mmx1.1mm), single die,