Proceedings of the 53rd European Microwave Conference Circularly Polarized Patch Antenna Array for 5G Automotive Satellite Communications Umais Tayyab#, Ashish Kumar#, Hans-Peter Petry*, Md. Golam Robbani#, Thomas Wack+, Matthias A. Hein# # RF & Microwave Research Group, Thuringian Center of Innovation in Mobility, Technische Universität Ilmenau, Germany * Deutsches Zentrum für Satellitenkommuni

Proceedings of the 53rd European Microwave Conference A Compact Reconfigurable Power Splitter Enabling a Full-Duplex Integrated Transceiver Employed for Joint Communication and Radar Sensing Farhad Bozorgi, Padmanava Sen Barkhausen Institut, Germany padmanava.sen-barkhauseninstitut.org that is employed in many hardware implementations today. The direct conversion TRx comprises of low noise ampli

Proceedings of the 53rd European Microwave Conference 6G Integrated Sensing and Communication: From Vision to Realization Thorsten Wild, Artjom Grudnitsky, Silvio Mandelli, Marcus Henninger, Junqing Guan, Frank Schaich Nokia Bell Labs, Germany -nokia-bell-labs.com upon commercially available 5G communications hardware in combination with dedicated sensing processing elements.

Proceedings of the 53rd European Microwave Conference Innovative Packaging Integration Strategy for BiCMOS ICs Operating beyond 200 GHz David A. Ovalle-Taylor123, Frédéric Gianesello1, Cyril Luxey2, Guillaume Ducournau3 1 STMicroelectronics, France Polytech?Lab, Polytech Nice-Sophia, Univ. Côte d?Azur, France 3 Univ. Lille, CNRS, Centrale Lille, UPHF, JUNIA, UMR 8520 - IEMN, France davidalexande

Proceedings of the 53rd European Microwave Conference Determination of Manufacturing Tolerances using Uncertainty Quantification for the Realization of a Dual Circularly Polarized Elliptical Feed Horn M.M. Bilgic, P. Meincke, T. Rubæk TICRA, Denmark {mmb, pme, tr}-ticra.com manufacturing tolerances necessary to build a feed horn with minimal expected variation in antenna performance. The paper i

Proceedings of the 53rd European Microwave Conference Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications Léa Roulleau, Laura Vauche, Olivier Valorge, Christophe Dubarry, Léa Di Cioccio CEA-Leti, France {lea.roulleau, laura.vauche, olivier.valorge, christophe.dubarry, lea.dicioccio}-cea.fr Abstract ? According to IPCC1, ?glo

Proceedings of the 53rd European Microwave Conference New Approach to Absolute Power Measurements in the WR-3 Band Benjamin Röben#, Karsten Lange*, Priyanka Mondal+, Pierre Gellie+, Andreas Steiger# # Physikalisch-Technische Bundesanstalt (PTB), Germany * SLT Sensor- und Lasertechnik GmbH, Germany + Lytid SAS, France benjamin.roeben-ptb.de, slt-pyrosensor.de, p.gellie-lytid.com bias, which grea

Proceedings of the 53rd European Microwave Conference Experimental Demonstration of a High Capacity THz-Wireless Dual Link Transmission System Oliver Stiewe#, Robert Elschner#, Thomas Merkle*, Kallyan Das#, Stefan Weide#, Colja Schubert#, Ronald Freund# # Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute, HHI, Germany *Fraunhofer Institute for Applied Solid State Physics, IAF

Proceedings of the 53rd European Microwave Conference Auto-Induced, Radiofrequency, Downlink Exposure Focused at the Human Ear Hanne Herssens, Arno Thielens Department of Information Technology, Ghent University-imec, Belgium hanne.herssens-ugent.be not depend on being a user or non-user. This exposure is denoted auto-induced DL (a-DL) exposure in literature [3] and is the subject of this study.

Proceedings of the 53rd European Microwave Conference Extracting Curvature Information From Low Fidelity Mesh for Electromagnetic Ray-Tracing Simulations in Automotive Scenarios Mohannad Saifo#, Alexander Ioffe*, Xiuzhang Cai$, Markus Stefer*, Markus Clemens# # Bergische Universität Wuppertal, Germany APTIV Services Deutschland GmbH, Germany $ APTIV Services US LLC, USA {mohannad.saifo, clemens}