EuMC: Cost Effective Wafer Level Chip Size Package Technology and Application to the Next Generation Automotive Radar
K. Tsukashima, M. Kubota, O. Baba, H. Tango, A. Yonamine, T. Tokumitsu, Y. Hasegawa
Proceedings of the 40th European Microwave Conference
Cost Effective Wafer Level Chip Size Package Technology and Application to the Next Generation Automotive Radar
K. Tsukashima, M. Kubota, O. Baba, H. Tango, A. Yonamine, T. Tokumitsu, and Y. Hasegawa
Sumitomo Electric Industries LTD, 1, Taya-cho, Sakae-ku, Yokohama, Kanagawa 244-8588, Japan
Abstract-- Cost effective 77GHz transmitter and recei