EuMIC: Cost Effective Wafer-Level Chip Size Package Technology and Application for High Speed Wireless Communications
Masaki Imagawa, Seiji Fujita, Tomio Satoh, Tsuneo Tokumitsu, Yuichi Hasegawa
Proceedings of the 4th European Microwave Integrated Circuits Conference
Cost Effective Wafer-Level Chip Size Package Technology and Application for High Speed Wireless Communications
Masaki Imagawa, Seiji Fujita, Tomio Satoh, Tsuneo Tokumitsu, and Yuichi Hasegawa SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Kokubo Kogyo Danchi, Showa-chou, Nakakoma-gun, Yamanashi, 409-3883, Japan
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