EuMC: Microstrip Thin-Film MCM-D Technology on High-Resistivity Silicon with Integrated Through-Substrate Vias
G. Posada, G. Carchon, P. Soussan, N. Pham, B. Majeed, D. Sabuncouglu, W. Ruythooren, B. Nauwelaers, W. De Raedt
Proceedings of the 37th European Microwave Conference
Microstrip Thin-Film MCM-D Technology on High-Resistivity Silicon with Integrated Through-Substrate Vias
G. Posada(1,2), G. Carchon(1), P. Soussan(1), N. Pham(1), B. Majeed(1), D. Sabuncouglu(1), W. Ruythooren(1), B. Nauwelaers(2), W. De Raedt(1) (1) IMEC, Div. MCP, Kapeldreef 75, B-3001 Heverlee, Belgium. (2) K.U.Leuven, Div. ESAT-TELEMIC, Ka