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A 2.4-GHz Low-Power Superregenerative RF Front-End for High Data Rate Applications
F. Xavier Moncunill-Geniz, Catherine Dehollain, Norbert Joehl, Michel Declercq, Pere Pala-Schonwalder
Proceedings of the 36th European Microwave Conference A 2.4-GHz Low-Power Superregenerative RF Front-End for High Data Rate Applications F. Xavier Moncunill-Geniz 1, Catherine Dehollain 2, Norbert Joehl 2, Michel Declercq 2, and Pere Palà-Schönwälder 1 Dept. of Signal Theory and Communications, Univ. Politècnica de Catalunya, 08034 Barcelona, Spain Phone: +34 934017072, e-mail: moncunill-tsc.upc.
LTCC Front-End Modules for Multi-Band Applications
Dongsu Kim, Hyun Min Cho, Nam-Kee Kang, Jong Chul Park, Jun Chul Kim
Proceedings of the 36th European Microwave Conference LTCC Front-end Modules for Multi-band Applications Dongsu Kim*, Hyun Min Cho, Nam Kee Kang, Jong Chul Park, and Jun Chul Kim Electronic Materials & Packaging Research Center Korea Electronics Technology Institute #68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-816, South Korea Tel: +82-31-789-7220, Fax: +82-31-789-7209 E-mail: *kimds
A Dual-Band VCO Integrated with RF-MEMS Switches and Inductors
Munenari Kawashima, Yo Yamaguchi, Kei Kuwabara, Norio Sato, Katsuyuki Machida, Kazuhiro Uehara
Proceedings of the 36th European Microwave Conference A Dual-Band VCO Integrated with RF-MEMS Switches and Inductors Munenari Kawashima1, Yo Yamaguchi1, Kei Kuwabara2, Norio Sato2, Katsuyuki Machida2, and Kazuhiro Uehara1 1 NTT Network Innovation Laboratories, NTT Corporation, 1-1 Hikarinooka Yokosuka, Kanagawa, 239-0847, Japan NTT Microsystem Integration Laboratories, NTT Corporation, 3-1 Morin
Ground Stations of Arrays to Increase the LEO Download Capacity
Sebastien Rondineau, Charles R. Dietlein, Zoya Popovic, Richard Q. Lee, Felix A. Miranda, Robert R. Romanofsky, Mary Ann Ingram, William C. Barott, John Langley, Daniel Mandl
Proceedings of the 36th European Microwave Conference Ground Stations of Arrays to Increase the LEO Download Capacity Sébastien Rondineau (1), Charles Dietlein (1), Zoya Popovi (1), Richard Q. Lee (2), Félix A. Miranda (2), Robert R. Romanofsky (2), Mary Ann Ingram (3), William C. Barott (3), John Langley (4), Daniel Mandl (5) (1) University of Colorado, Boulder, CO 80309-0425, USA tel+1 303 492
Design Guidelines for a Novel Tapered Drain Line Distributed Power Amplifier
Prasad N. Shastry, Amir S. Ibrahim
Proceedings of the 36th European Microwave Conference Design Guidelines for a Novel Tapered Drain Line Distributed Power Amplifier Prasad N. Shastry (S. N. Prasad)1, Amir S. Ibrahim2 1 Bradley University, Department of Electrical and Computer Engineering, Peoria, IL 61625, USA. 2 Motorola Inc., Mobile Devices, Libertyville, IL 60048, USA. each cell of a DA, the cell outputs are sequentially conn
A Novel Wideband GaAs FET Source Injected Distributed Mixer
Prasad N. Shastry, Edward W. Cullerton
Proceedings of the 36th European Microwave Conference A Novel Wideband GaAs FET Source Injected Distributed Mixer Prasad N. Shastry (S. N. Prasad) 1, Edward W. Cullerton2 1 Bradley University, Department of Electrical and Computer Engineering, Peoria, IL 61625, USA. 2 Fermi National Laboratory, MS 341, Batavia, IL 60510, USA. gate lines. The IF signal is obtained on the common drain line through
Silicon Micromachined W-Band Bandpass Filter Using DRIE Technique
Yuan Li, Pete L. Kirby, John Papapolymerou
Proceedings of the 36th European Microwave Conference Silicon Micromachined W-Band Bandpass Filter Using DRIE Technique Yuan Li, Pete L. Kirby, and John Papapolymerou School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332 Abstract-- A silicon micromachined W-band 3-pole bandpass filter using deep reactive ion etching technology with stacked silicon substr
Advanced 3D Packaging Using Novel Liquid Crystalline Polymer Based Substrates
Camil-Daniel Ghiu, Sidharth Dalmia, Jack Vickers, Larry Carastro, Winston Czakon, Venky Sundaram, George White
Proceedings of the 36th European Microwave Conference Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates Camil-Daniel Ghiu, Sidharth Dalmia, Jack Vickers, Larry Carastro, Winston Czakon, Venky Sundaram*, George White Jacket Micro Devices, Atlanta, Georgia, 30308, USA * Packaging Research Center, Georgia Institute of Technology, Atlanta, Georgia, 30332, USA Abstract -- T
A Capacitively-Loaded Quasi-Planar Ka-Band Resonator
Kenneth Vanhille, Daniel Fontaine, Christopher Nichols, Zoya Popovic, Dejan Filipovic
Proceedings of the 36th European Microwave Conference A Capacitively-Loaded Quasi-Planar Ka-Band Resonator Kenneth Vanhille , Daniel Fontaine, Christopher Nichols , Zoya Popovi´ , and Dejan Filipovi´ c c Department of Electrical and Computer Engineering University of Colorado, Boulder, CO 80309-0425 USA BAE Systems, Nashua, NH 03060 USA Rohm and Haas Electronics Materials LLC, Blacksburg, VA
Thermal Characterization of Compact Inductors and Capacitors for 3D MMICs
L. Krishnamurthy, V.T. Vo, A.A. Rezazadeh
Proceedings of the 36th European Microwave Conference Thermal Characterization of Compact Inductors and Capacitors for 3D MMICs L. Krishnamurthy, V. T. Vo, A. A. Rezazadeh The Electromagnetics Research Centre for Microwave and mm-Wave Designs and Applications, School of Electrical and Electronics, The University of Manchester, P.O. Box 88, M1 6QD, UK. Tel: +44 161 306 4686, Email: l.krishnamurthy
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