A GaAs-HBT Broadband Amplifier with Near-fT Cut-off Frequency for High-Bitrate Transmission Chafik Meliani, Matthias Rudolph, Jochen Hilsenbeck, and Wolfgang Heinrich Ferdinand-Braun-Institut für Hoechstfrequenztechnik (FBH), 12489 Berlin / Germany Email: meliani-fbh-berlin.de Abstract -- A broadband amplifier for high-bitrate transmission is presented, using a standard GaAs-HBT process with fT an

A New Resonant Probe for Dielectric Permittivity Measurement M. Dionigi, A. Ocera, E. Fratticcioli, R.Sorrentino University of Perugia, DIEI, via G.Duranti 93, 06125, Perugia, Italy phone +39 075 585 3653 (secr.) fax +39 075 585 3654 Abstract -- A new resonant probe for dielectric permittivity measurements has been designed and tested. The probe provides a large interaction volume and can be inser

A new approach to RF thin film microinductors Michael Frommberger1, Michael Tewes1, Jeffrey McCord2, Wolfgang Hartung3, Reinhard Losehand3, and Eckhard Quandt1 center of advanced european studies and research, caesar, Ludwig Erhard Allee 2, 53175 Bonn, Germany, phone: +49 228 9656 229, frommberger-caesar.de 2 Leibniz Institute for Solid State and Materials Research IFW Dresden, Insitute for Metall

Improved Performance of Flip Chip assembled MMIC Amplifiers on LTCC using a Photonic Bandgap Structure A. Ziroff*, M. Nalezinski*, W. Menzel** *Siemens Corporate Technology, Otto Hahn Ring 6, 81730 Munich, Germany **Microwave Techniques, University of Ulm, Germany Abstract -- Further cost reduction in today's microwave frontends is strongly related to assembly technology as well as module technol

Filter-Phase Shifters Based on Thin Film Ferroelectric Varactors S. Abadei*, A. Deleniv*, and S. Gevorgian*,# * Department of Microtechnology and Nanoscience MC-2, Chalmers University of Technology, Sweden Phone:+46-(0)31 7721853, Fax: +46-(0)31 164513, EMail: saeed.abadei-mc2.chalmers.se # Microwave and High Speed Research Center, Ericsson AB 431 84 Mölndal, Sweden four resonators realizing fou

Polar Modulation-Based RF Power Amplifiers with Enhanced Envelope Processing Technique J.K. Jau1, F.Y. Han1, M.C. Du1, T.S. Horng1 and T.C. Lin2 National Sun Yat-Sen University, Department of Electrical Engineering, 70 Lien-Hai Rd., Kaohsiung 804, Taiwan Tel: 886-7-5254119, e-mail: jason-ee.nsysu.edu.tw 2 Industrial Technology Research Institute, Computer and Communication Research Laboratory, 195

Microwave Characterization of Ferroelectric Ceramic Films A. Deleniv*, S. Gevorgian*,#, H. Jantunnen&, and T. Hu& * Department of Microtechnology and Nanoscience MC-2, Chalmers University of Technology 41296 Gothenburg, Sweden * Ericsson AB, Flöjelbergsgatan 2A, 431 84, Mölndal, Sweden & ,# University of Oulu, Microelectronics and Physics Laboratory and EMPART Research Group of Infotech, Oulu Ab

Universal Broadband Antenna Elements Employing Metallized Plastics Technology Martin Wagner, Mischa Graeni, Jan Hesselbarth, Peter Nuechter, and Uhland Goebel HUBER+SUHNER AG, Tumbelenstr. 20, CH-8330 Pfäffikon, Switzerland. Phone: +41 1 952 2993, Fax: +41 1 952 2844, Email: mwagner-hubersuhner.com Abstract -- A new type of antenna element has been developed. It combines a pair of crossed dipoles

New Trends For Multiharmonic Source-Pull And Load-Pull Measurements S. LELOIR1, F. FOUQUET2, C.TOLANT1, P.EUDELINE1, B.MAZARI2 THALES AIR DEFENCE - Z.I. du Mont Jarret 76520 Boos ­ France Tel : 33 2 32 86 44 00 - Fax : 33 2 32 86 43 05 - Email : sebastien.leloir-fr.thalesgroup.com 2 IRSEEM ­ Technopôle du Madrillet 76801 Saint Etienne du Rouvray ­ France Tel : 33 2 32 91 58 58 - Fax : 33 2 32 91 5

A Novel De-embedding Technique for On-Wafer Microwave Characterization Ming-Hsiang Cho1, Guo-Wei Huang1, Kun-Ming Chen1, An-Sam Peng1, Chia-Sung Chiu1, Yu-Min Teng1, and Han-Yu Chen2 1 National Nano Device Laboratories, 1001-1 Ta Hsueh RD., Hsinchu 300, Taiwan, R.O.C., PHONE: +886-3-5726100 2 Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan, R.O.C. based on parallel-s