Multi-Band Base Station Antenna for Diversity and MIMO-Applications Florian Pivit 1, Georg Fischer 2, Christian Waldschmidt 1, Werner Wiesbeck 1 1 University of Karlsruhe, Institut für Höchstfrequenztechnik und Elektronik (IHE), D - 76128 Karlsruhe, Germany, Phone: +49-721-608-7163, e-mail: florian.pivit-ihe.uka.de 2 Lucent, Bell Labs Europe, Thurn-und-Taxis-Strasse 10, D - 90411 Nürnberg, German

RF Power Amplifier Nonlinearity Modelling and Intermodulation Distortion Analysis in OFDM Signal Transmitter Systems Mairtin S. O'Droma1, Nana Mgebrishvili2, Anthony A. Goacher2 1 ECE Dep., University of Limerick, Limerick, Ireland, mairitn.odroma-ul.ie 2 As above, but nana.mgebrishvili-ul.ie, tony.goacher-ul.ie Abstract -- Nonlinear power amplifier (PA) behavioural modelling issues of high cres

Design and Evaluation of a Novel Spark-Plug Based on a Microwave Coaxial Resonator Klaus Linkenheil1, Hans-Oliver Ruoß1, Wolfgang Heinrich2 1 Robert Bosch GmbH, Robert-Bosch-Platz 1, 70839 Gerlingen-Schillerhöhe, Germany, Tel.: +49-711-8116510, Fax: +49-711-8116315, E-mail: Klaus.Linkenheil-de.bosch.com 2 Ferdinand-Braun-Institut (FBH), Albert-Einstein-Str. 11, 12489 Berlin, Germany, Tel: +49-30-

Hybrid Full-wave Analysis of Stepped Horn Antennas with waveguides of arbitrary cross-sections V. Crin¶ y, C. Tomassoni z, M. Mongiardo z, A.S. Omar # o ySpace Engineering S.p.A., Via Dei Berio 91, 00155 Rome, Italy, e-mail: crino-space.it, phone: +39 0622595253, FAX: +39 062280739 zDIEI, University of Perugia, Via G. Duranti, 93, 06125, Perugia, Italy, e-mail: mongiardo-diei.unipg.it, tomassoni-d

Three-Dimensional X-band New Transformer Balun Configuration Using the Multilayer Ceramic Technologies Pei-Si Wu1, Chao-Hsiung Tseng1, Ming-Fong Lei1, Tian-Wei Huang1, Huei Wang1, and Philip Liao2 Dept. of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei,106 Taiwan, R.O.C. E-Mail: hueiwang-ew.ee.ntu.edu.tw, Tel: 886-2-23635251 ext 317,

A Miniature 4.3-7-GHz, 1-V CMOS LNA with Helical Inductors Ming-Da Tsai, Huei Wang, Jui-Feng Kuan*, Chih-Ping Chao* Department of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, R.O.C. Phone: +886-2-23635251 ext.317 Fax: +886-2-23638247 e-mail: hueiwang-ew.ee.ntu.edu.tw * Taiwan Semiconductor Manufacturing Corporation, Hsinchu

RF MEMS: status of the industry in 2004, application roadmap and market forecasts Jérémie Bouchaud, Dr. Henning Wicht WTC ­ Wicht Technologie Consulting, Frauenplatz 5, D-80331 Munich, Germany, +49(0)89 2070 260-20 jeremie.bouchaud-wtc-consult.de, henning.wicht-wtc-consult.de Abstract -- The presentation will give an overview on RF MEMS applications and market players. WTC will highlight technica

Millimetre-wave MMIC packaging compatible with surface-mount technology (SMT) J. Galière, J.L. Valard, E. Estèbe Thales Airborne Systems, 2, avenue Gay-Lussac 78851 ELANCOURT France Abstract --- This paper presents an interconnect and packaging solution for millimetre-wave MMIC, based on collective wiring and surface mount technologies. The designed structure consists of an SMT CSP (Chip Scale Pac

Phase-Shifting Coplanar Stubline-Filter on Ferroelectric-Thick Film Patrick Scheele , Stefan Müller , Carsten Weil , and Rolf Jakoby Darmstadt University of Technology, Institute of Microwave Engineering Merckstrasse 25, 64289 Darmstadt, Germany. E-mail: scheele-hf.tu-darmstadt.de Advanced Ferrite Technology GmbH, Spinnerei 44, 71522 Backnang, Germany Abstract-- The use of tunable coplanar stublin

Fully Integrated and Plastic Packaged 24 GHz VCO for ISM and Automotive Applications P. Cortese 1, M. Camiade1, W. Doser2, J. Schaefer3, N. Moeller3 1 United Monolithic Semiconductors S.A.S, route départementale 128 ­ BP46, F-91401 Orsay Cedex, France 2 United Monolithic Semiconductors GmbH, Wilhelm-Runge-Strasse 11, D89081 Ulm, Germany 3 M/A-Com, Tyco Electronics, Lowell, Massachusetts, 01853-