Concept And Realisation of the Ka-Band Highly Integrated Front End Module U. Güttich**, J. Schupp*, C. Holtzhaussen**, K. Osterschek* *Astrium GmbH, 81663 München, Germany **EADS Deutschland GmbH, Wörthstrasse 85, D-89070 Ulm, Germany Email: ulrich.guettich-sysde.eads.net Design, fabrication, and test results of the Highly Integrated Front End (HIFE) Rx Module for Ka-band frequencies realised in m

CHARACTERIZATIONS OF RECTANGULAR COAXIAL LINE FABRICATED ON SILICON SUBSTRATE Yong Zhong Xiong,* Liao Huailin, Shi Jinglin and Subhash C. Rustagi VSLI Circuit Design & Test Department Institute of Microelectronics 11 Science Park Road, Singapore Science Park II, Singapore 117685 *Corresponding author, Tel: (65) 6770-5379, Fax: (65) 67745754, e-mail: yongzhong-ime.a-star.edu.sg Abstract Miniature R

Silicon Micromachined CPW Transmission Lines Karl M. Strohm, Franz Josef Schmückle*, Bernd Schauwecker, Wolfgang Heinrich*, and Johann-Friedrich Luy DaimlerChrysler Research Center,Wilhelm-Runge-Str. 11, D-89081 Ulm, Germany E-mail: karl.strohm-daimlerchrysler.com * Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH), Albert-Einstein-Str. 11, D-12489 Berlin, Germany, E-mail: schmueck-fbh-berl

MODELING OF INVERTED COUPLED MICROSTRIP LINES FABRICATED USING MEMS TECHNOLOGY A. Richardson*, L. Martoglio*, L. Cirio*, E. Richalot*, G. Lissorgues-Bazin** O. Picon* * Université de Marne-la-Vallée, Bâtiment Copernic, rue Galilée, 77454 Marne-la-vallée- France, ** Groupe ESIEE, Cité Descartes, 93162 Noisy-le-Grand ­ France. Contact : lmartogl-univ-mlv.fr Abstract- 3D electromagnetic simulation

Surface Micromachined RF Inductors and Transformers for Advanced Telecommunication Applications Jae Y. Park, Yun S. Eo, and Jong U. Bu Microsystem Group LG Electronics Institute of Technology 16 Woomyeon-Dong, Seocho-Gu, Seoul, 137-724, Korea E-mail: jpark41-LG-Elite.com, Tel: +82-2-526-4550, Fax: +82-2-3461-3508 In this paper, Surface micromachined RF inductors and transformers have been newly de

CPW Interconnects for MMIC Applications on Low Resistivity CMOS Grade Silicon Using Micromachined SU8 Negative Resist Khaled Elgaid, David L. Edgar, David A. McCloy, Iain G. Thayne Nanoelectronics Research Centre, Department of Electronics and Electrical Engineering University of Glasgow, Glasgow, G12 8LT, Scotland, United Kingdom Phone: + 44 141 3306678, Fax: + 44 141 330 4907, e-mail: kelgaid-el

Numerical Investigation of Transmission Lines and Components in Damascene Technology Dzianis Lukashevich, Larissa Vietzorreck and Peter Russer Institut f¨r Hochfrequenztechnik, Technische Universit¨t M¨nchen u a u Arcisstr. 21, D-80333 Munich, Germany eMail: vietzorreck-ei.tum.de Abstract The development of multilayered, highly integrated circuit boards using damascene technology and copper as a

A New Modeling Approach for Embedded Passives Exploiting State Space Formulation X. Ding, J.J. Xu, M.C.E. Yagoub*, Q.J. Zhang Dept of Electronics, Carleton University, 1125 Colonel By Dr., Ottawa, Canada K1S 5B6, xding-doe.carleton.ca, jxu-doe.carleton.ca, qjz-doe.carleton.ca * School of Information Tech. and Engineering, University of Ottawa, Ottawa, Canada, K1N 6N5, myagoub-site.uottawa.ca In th

Parameterized Circuit Modeling of Planar Transmission Line Structures on Arbitrary Substrates Tom Dhaene*, Jan De Geest**, Daniël De Zutter** * Agilent EEsof Comms EDA, Agilent Technologies, tom_dhaene-agilent.com ** Department of Information Technology (INTEC) - Ghent University A new automated circuit-modeling tool is presented for arbitrary planar transmission lines. The tool builds compact, p

Design Consideration and Performance Analysis of Substrate Integrated Waveguide Components Dominic Deslandes, Ke Wu Poly-Grames Research Center, École Polytechnique de Montréal, C.P. 6079, Succ. Centre Ville, Montréal, Québec, H3C 3A7, Canada, deslad-grmes.polymtl.ca Abstract--This paper presents a new design scheme and measurement results of circuit discontinuities on the basis of the recently pr