THREE-DIMENSIONAL MMIC INTERCONNECT PROCESS USING PHOTOSENSITIVE BCB AND STO CAPACITORS
K. Inoue, K. Kamogawa, K. Nishikawa, K. Ikuta, K. Onodera, M. Hirano
THREE-DIMENSIONALMMIC
PHOTOSENSITIVE
INTERCONNECT PROCESS BCB AND STO CAPACITORS
USIN G
Koh Inoue, Kenji Kamogawa*, Kenjiro Nishikawa*, Kenji Ikuta, Kiyomitsu Onodera**, and Makoto Hirano*** NTT System Electronics Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan kinoue-aec1.ntt.co.jp, ikuta-aec1.nttco.jp *NTT Wireless Systems Laboratories, Hikari-no-oka, Yokosuka-sh