FLIP-CHIP MODULES FOR MILLIMETER-WAVE SENSOR APPLICATIONS
T.V. Kerssenbrock, H. Tischer, H.J. Siweris, W. Bogner, C. Schmelz, T. Meier, W. Kellner, P. Heide
FLIP-CHIP MODULES FOR MILLIMETER- WAVE SENSOR APPLICATIONS
T. v. Kerssenbrock, H. Tischer, H.J. Siweris, W. Bogner*, C. Schmelz*, T. Meier*, W. Kellner, P. Heide SIEMENS AG - Corporate Technology, ZT KM, D-81730 Munich I Germany
*SIEMENS AG
- Semiconductor
Group, HL HF PE, D-81617 Munich I Germany
E-mail: thomas.kerssenbrock-mchp.siemens.de, ABSTRACT
Tel. +49 89 636-43650, Fax +49 89 636-43702