FLIP-CHIP MOUNTED GaAs POWER FET WITH IMPROVED PERFORMANCE IN X TO Ku BAND
Y. Mitsui, M. Otsubo, T. Ishii, S. Mitsui, K. Shirahata
FLIP-CHIP
MOUNTED
GaAs POWER FET WITH
IMPROVED
PERFORMANCE
IN X TO Ku BAND Y.MITSUI, ABSTRACT A GaAs power MESFET with a new structure, which allows extremely reduced source inductances and minimized thermal resistance, has been developed. In the structure, the chip with metal posts plated on the source, drain and gate pads is connected directly to the package with no wire. Best results obtai