EuMC: Integration of Lange Couplers in SiGe BiCMOS Technology for RF and mm-Wave Applications: Perspectives for Distributed Chip-Package-PCB Co-Integration
S. Wane, L. Leyssenne, O. Tesson, O. Doussin, D. Bajon, D. Lesenechal, T.V. Dinh, M.P. van Heijden, Ralf Pijper, P. Magnee, P. Descamps, A. Erdem
Proceedings of the 45th European Microwave Conference
Integration of Lange Couplers in SiGe BiCMOS Technology for RF and mm-Wave Applications
Perspectives for distributed Chip-Package-PCB Co-Integration
S. Wane#, L. Leyssenne§, O. Tesson#, O. Doussin, D. Bajon, D. Lesénéchal§, T.V. Dinh§, M.P. van Heijden*, Ralf Pijper*, P. Magnée^, P. Descamps§, A. Erdem#
NXP-Semiconductors Caen, France § NXP-La