Proceedings of the 53rd European Microwave Conference Reconfigurable Impedance Matching Network for 5G Mid-Band Utilizing Phase-Change Materials Tejinder Singh, Raafat R. Mansour Centre for Integrated RF Engineering, Department of Electrical and Computer Engineering, and Waterloo Institute for Nanotechnology, University of Waterloo, Canada tejinder.singh-uwaterloo.ca Phase-Change SPST Switch Ab

Proceedings of the 53rd European Microwave Conference Design Methodologies for mm-Wave Transceivers in Bi(CMOS) for Next-Generation Wireless and Optical Applications Domenico Pepe Renesas Design Zurich AG, Switzerland domenico.pepe.nx-renesas.com Abstract ? Advancements in silicon technology have enabled the design of millimeter wave integrated circuits front-end capable of operating at frequenc

Proceedings of the 53rd European Microwave Conference Waveguide Measurements of Highly Anisotropic Graphene Augmented Inorganic Nanofibers Nikolaos Xenidis# , Serguei Smirnov# , Aleksandra Przewloka* , Aleksandra Krajewska* , Joachim Oberhammer# , Dmitri Lioubtchenko#* # Division of Micro and Nanosystems, KTH Royal Institute of Technology, Sweden Laboratories, Institute of High Pressure Physics,

Proceedings of the 53rd European Microwave Conference Scalable Phased-Arrays at 140 GHz using RF and IF Beamforming Techniques Amr Ahmed, Minjae Jung, Siwei Li, Linjie Li, Gabriel M. Rebeiz University of California, San Diego, USA {aaahmed, mijung-eng., sil196, lil030, grebeiz}-ucsd.edu Abstract ? The paper presents large RF-beamforming arrays (64 elements and higher) capable of 24 Gbps communica

Proceedings of the 53rd European Microwave Conference Experimental Investigation of Millimeter-Wave 3D Image Projection Using Dielectric Lens for Security Application 14* 2 3 1 Arie Setiawan , Naruto Yonemoto , Hitoshi Nohmi , Hiroshi Murata 1 2 Graduate School of Engineering, Mie University, Japan Electronic Navigation Research Institute, National Institute of Maritime, Port, and Aviation

Proceedings of the 53rd European Microwave Conference A Picosecond Pulse Transmission and Reception System for Next Generation Wireless Sensing and Imaging Applications MuhibUr Rahman, Ke Wu Department of Electrical Engineering and Poly-Grames Research Center, Polytechnique Montreal, Canada {muhibur.rahman, ke.wu}-polymtl.ca Abstract ? This paper proposes and presents a complete ultrafast wirele

Proceedings of the 53rd European Microwave Conference Advanced Packaging Technologies: Interconnects and Front-End Modules for Millimeter-Wave 5G/Beyond Applications Kamal K. Samanta AMWT Ltd., UK kksamanta-ieee.org Abstract ? Firstly, this keynote will present advanced and cost-effective multilayer integration and packaging technologies with their relative performance, maturity, and cost for in

Proceedings of the 53rd European Microwave Conference Wideband Cross-Domain Characterization of a W-band Amplifier MMIC # # * # Benjamin Schoch , Dominik Wrana , Axel Tessmann , Ingmar Kallfass # Institute of Robust Power Semiconductor Systems, University of Stuttgart, Germany * Fraunhofer Institute for Applied Solid State Physics (IAF), Germany {Benjamin.Schoch, Dominik.Wrana, Ingmar.Kallfa

Proceedings of the 53rd European Microwave Conference A Dual-Carrier Linear-Frequency Modulated Waveform for High-Accuracy Localization in Distributed Antenna Arrays Ahona Bhattacharyya, Jason M. Merlo, Jeffrey A. Nanzer Electrical and Computer Engineering, Michigan State University, USA {bhatta67, merlojas, nanzer}-msu.edu The linear frequency modulated (LFM) ranging waveform has been extensive

Proceedings of the 53rd European Microwave Conference SLS-Printed E-Band Waveguides and the Impact of Surface Roughness A. Hofmann, K. Lomakin, M. Kleinlein, T. Bader, M. Sippel, G. Gold Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nürnberg, Germany {Andreas.Hofmann, Konstantin.Lomakin, Micha.Kleinlein, Tobias.eddy.Bader, Mark.Sippel, Gerald.Gold}-fau.de Abstract