EuMC: Novel Packaging, Cooling and Interconnection Method for GaN High Performance Power Amplifiers and GaN Based RF Front-Ends
A. Margomenos, M. Micovic, A. Kurdoghlian, K. Shinohara, D.F. Brown, C. Butler, I. Milosavljevic, P.B. Hasimoto, R. Grabar, P.J. Willadsen, R. Bowen, P. Patterson, M. Wetzel, D.H. Chow
Proceedings of the 42nd European Microwave Conference
Novel Packaging, Cooling and Interconnection Method for GaN High Performance Power Amplifiers and GaN Based RF Front-Ends
A. Margomenos, M. Micovic, A. Kurdoghlian, K. Shinohara, D. F. Brown, C. Butler, I. Milosavljevic, P. B. Hasimoto, R. Grabar, P. Willadsen, R. Bowen, P. Patterson, M. Wetzel, D. H. Chow
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