Proceedings of the 2nd European Microwave Integrated Circuits Conference Low-Frequency Dynamic Drain Current Modeling in AlGaN-GaN HEMTs V. Di Giacomo*, A. Santarelli#1, F. Filicori#, A. Raffo*, G.Vannini*, R. Aubry·, C. Gaquière· * # Department of Engineering, University of Ferrara, Via Saragat 1, 44100 Ferrara, Italy Department of Electronics, University of Bologna, Viale Risorgimento 2, 40136

Proceedings of the 2nd European Microwave Integrated Circuits Conference Theoretical Aspects and Numerical Solution of Scattering from Objects under Grazing Angle Incidence - The A380 and the Aircraft Tailfin Gerhard Greving1, Wolf-Dieter Biermann1 NAVCOM Consult Ziegelstr. 43, D-71672 Marbach, Germany 1 1 navcom.consult-t-online.de Abstract-- System simulations require the systematic scatteri

Proceedings of the 2nd European Microwave Integrated Circuits Conference An X-Band High Power Amplifier Module Package Using Selectively Anodized Aluminum Substrate 1 Sung-Ku Yeo, 2Jong-Hoon Chun, 1Kyoung-Min Kim, 1Jong-Min Yook, and 1Young-Se Kwon 1 2 Dept. EECS, KAIST 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, Republic of Korea Radar System Group, SAMSUNG THALES CO., LTD. Chang-Li 30

Proceedings of the 2nd European Microwave Integrated Circuits Conference Mechanically Tri-Stable SPDT Metal-Contact MEMS Switch Embedded in 3D Transmission Line Mikael Sterner 1 , Niclas Roxhed, Göran Stemme, Joachim Oberhammer Microsystem Technology Lab School of Electrical Engineering Royal Institute of Technology SE-100 44 Stockholm, Sweden 1 msterner-kth.se Abstract-- This paper presents an

Proceedings of the 2nd European Microwave Integrated Circuits Conference 30 GHz (Ka-band) VSAT DVB-RCS Mixer-Driver Multifunction MMIC Ian Hardcastle1, Steve Melvin, James Mayock, Andrew Collar, Paul Simpson, Mike Brookbanks, Ian Bisby Filtronic Compound Semiconductors Ltd, Heighington Lane Business Park, Newton Aycliffe, County Durham, DL5 6JW, UK. 1 ian.hardcastle-filcs.com Abstract-- This pa

Proceedings of the 2nd European Microwave Integrated Circuits Conference Single-chip RF Front-end MMIC using InGaAs E/DpHEMT for 3.5 GHz WiMAX Applications Yu-Cheng Hsu#1, Ping-Hsun Wu#2, Cheng-Chung Chen#3, Jian-Yu Li#4, Sheng-Feng Lee#5, Wu-Jing Ho*1, Cheng-Kuo Lin*2 # Information & Communications Research Laboratories, Industrial Technology Research Institute, 195 Sec. 4, Chung Hsing Rd., Chu

Proceedings of the 2nd European Microwave Integrated Circuits Conference A 6W Uneven Doherty Power Amplifier in GaN Technology A. Z. Markos 2, P. Colantonio1, F. Giannini1, R. Giofrè1, M. Imbimbo1, G. Kompa2 1 Univ. of Roma Tor Vergata, Dept. of Electronic Eng., Via del Politecnico 1, 00133 Roma Italy paolo.colantonio-uniroma2.it 2 Univ. of Kassel, Dept. of High Freq. Technique, Wilhelmshoeher

Proceedings of the 2nd European Microwave Integrated Circuits Conference The slow relaxation of capacitance in ferroelectric devices under electrical pulse influence A.V. Tumarkin, S.V. Razumov, A.G. Gagarin, M.M. Gaidukov, A.B Kozyrev Department of Electron Ion and Vacuum Technology, St. Petersburg Electrotechnical University 197376, 5 Prof. Popov str., St. Petersburg, Russia thinfilm-eltech.ru

Proceedings of the 2nd European Microwave Integrated Circuits Conference Microstrip Thin-Film MCM-D Technology on High-Resistivity Silicon with Integrated Through-Substrate Vias G. Posada(1,2), G. Carchon(1), P. Soussan(1), N. Pham(1), B. Majeed(1), D. Sabuncouglu(1), W. Ruythooren(1), B. Nauwelaers(2), W. De Raedt(1) (1) IMEC, Div. MCP, Kapeldreef 75, B-3001 Heverlee, Belgium. (2) K.U.Leuven, Di

Proceedings of the 2nd European Microwave Integrated Circuits Conference Simultaneous Dual-Band High Efficiency Harmonic Tuned Power Amplifier in GaN Technology P. Colantonio, F. Giannini, R. Giofrè, L. Piazzon. Elect. Engineering Department, University of Rome Tor Vergata Via del Politecnico 1, 00133 Roma, Italy, +(39) 06 72597346 giofr-ing.uniroma2.it Abstract-- In this contribution for the fir