Proceedings of the 1st European Microwave Integrated Circuits Conference Antenna-coupled microbolometers for passive THz direct detection imaging arrays P. Helistö1, A. Luukanen2, L. Grönberg1, J.S. Penttilä1, H. Seppä1, H. Sipola1, C.R. Dietlein3 and E.N. Grossman4 VTT Technical Research Centre of Finland, P.O. Box 1000, 02044 VTT, Finland MilliLab c/o VTT Technical Research Centre of Finland, P

Proceedings of the 1st European Microwave Integrated Circuits Conference A 1.3V Low Phase Noise 2-GHz CMOS Quadrature LC VCO Parag Upadhyaya1, Deukhyoun Heo1, Yi-Jan Emery Chen2 1 Washington State University, The School of Electrical Engineering and Computer Science, Pullman, WA 99164­2752 USA, pupadhya-eecs.wsu.edu, (512) 659-8005 2 National Taiwan University, Department of Electrical Engineeri

Proceedings of the 1st European Microwave Integrated Circuits Conference New de-embedding technique based on Cold-FET measurement G. Pailloncy and J.-P. Raskin Microwave Laboratory, Université catholique de Louvain, 3, Place du Levant, 1348 Louvain-la-Neuve, Belgium. email : raskin-emic.ucl.ac.be Abstract -- In this paper, we present a new de-embedding technique which does not require any dedicat

Proceedings of the 1st European Microwave Integrated Circuits Conference Foturan Cap and BCB Sealing-Ring for RF MEMS Packaging Applications David Peyrou1, Patrick Pons1, Arnaud Nicolas2, Jun-Wu Tao3, Hugues Granier1, Robert Plana1 LAAS-CNRS, 7 Av. Colonel Roche 31077 Toulouse cedex 4, France (2) MEMSCAP, Les fontaines Bernin 38926 Crolles cedex, France (3) ENSEEIHT-LEN7, 2 rue Charles Camichel 3

Proceedings of the 1st European Microwave Integrated Circuits Conference A Compact 8W S/C-Band MMIC Power Amplifier Designed for CW Telemetry Applications C. Costrini1, A. Bettidi1, M. Calori1,A. Cetronio1, M. Feudale2, C. Lanzieri1, C. Proietti1 (1) SELEX Sistemi Integrati S.p.A. Engineering Division, Via Tiburtina, Km 12.400, 00131 Roma Italy (2) Alcatel Alenia Space Italia S.p.A., Via Saccomur

Proceedings of the 1st European Microwave Integrated Circuits Conference Monte Carlo Comparison Between InP-Based Double-Gate and Standard HEMTs B. G. Vasallo1, N. Wichmann1, S. Bollaert1, A. Cappy1, T. González2, D. Pardo2 and J. Mateos2 1 IEMN-DHS, UMR CNRS 8520, Avenue Poincaré BP60069, 59652, Villeneuve d'Ascq CEDEX, France 2 Departamento de Física Aplicada, Universidad de Salamanca, Plaza d

Proceedings of the 1st European Microwave Integrated Circuits Conference Very High Performance GaN HEMT devices by Optimized Buffer and Field Plate Technology P.Romanini1, M. Peroni1, C. Lanzieri1, A. Cetronio1, M. Calori1 A. Passaseo2, B. Potì2, A. Chini3, L. Mariucci4, A. Di Gaspare4, V. Teppati5, V. Camarchia5. 1 Selex Sistemi Integrati S.p.A., Engineering Division; Via Tiburtina, Km 12,400;

Proceedings of the 1st European Microwave Integrated Circuits Conference Indium Antimonide based Quantum Well FETs for Ultra-high Frequency, Low Power Dissipation Circuits T. Ashley*, L. Buckle, M. T. Emeny, M. Fearn, D. G. Hayes, K. P. Hilton, R. Jefferies, T. Martin, T. J. Phillips, J. Powell, A. W. H. Tang, D. Wallis and P. J. Wilding QinetiQ, Malvern Technology Centre, St Andrews Road, Malver

Proceedings of the 1st European Microwave Integrated Circuits Conference Incorporating the Single-Loop Delta-Sigma Modulator in Fractional-N Frequency Synthesizer for Phase-Noise Improvement C.J. Li1, C.H. Huang1, W.H. Ho1, T.S. Horng1, and K.C. Peng2 Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung 804, Taiwan phone: (886)-7-5254119, e-mail: jason-ee.nsysu.edu.tw

Proceedings of the 1st European Microwave Integrated Circuits Conference InP DHBT based MMICs for [DC-20 GHz] Signal Sampling Hassan El Aabbaoui1, Benoît Gorisse1, Aziz Benlarbi-Delaï1, Nathalie Rolland1, Virginie Allouche2, Nicolas Fel2, Bernard Riondet3, Pascal Leclerc2, Paul-Alain Rolland1 (1) Département Hyperfréquence et Semiconducteur, IEMN CNRS 8520, University of Lille 1, Av. Poincaré BP