Advanced 3D Packaging Using Novel Liquid Crystalline Polymer Based Substrates
Camil-Daniel Ghiu, Sidharth Dalmia, Jack Vickers, Larry Carastro, Winston Czakon, Venky Sundaram, George White
Proceedings of the 1st European Microwave Integrated Circuits Conference
Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates
Camil-Daniel Ghiu, Sidharth Dalmia, Jack Vickers, Larry Carastro, Winston Czakon, Venky Sundaram*, George White Jacket Micro Devices, Atlanta, Georgia, 30308, USA * Packaging Research Center, Georgia Institute of Technology, Atlanta, Georgia, 30332