EUROPEAN MICROWAVE ASSOCIATION EuMA EuMA starts its proceedings With this inaugural issue of the EuMA Proceedings the European Microwave Association starts its new journal for the purpose of creating a focus for the European microwave community, and for providing a high quality, affordable microwave journal. Microwave researchers and users are invited to submit papers and help make the EuMA Proc

Advanced material modelling in the time-domain Christos Christopoulos, John Paul, David W.P. Thomas Abstract -- In this paper, the development and implementation of algorithms for the incorporation of materials having frequency-dependent properties in time-domain electromagnetic codes is reviewed. Examples are shown for typically encountered materials in wave interaction studies, e.g. carbon-loade

A very thin and compact smart skin X-band digital beamforming antenna Andreas Gustafsson, Robert Malmqvist, Lars Pettersson, Gunnar Huss, Mattias Alfredson, Staffan Lindstrom, Isabel Ferrer, Per Grahn, Stig Leijon, Carl Samuelsson, Tony Nilsson, Anna Pohl, Aziz Ouacha, Borje Carlegrim, Sven Hagelin, Roland Erickson Abstract -- In this paper, we present a very thin and compact (7x127x125 mm3) broad

A novel RF MEMS switch compatible with CMOS technology Yongming Cai, Linda Katehi' Abstract -- A novel RF MEMS series switch with metal-tometal contact has been developed to operate from 2 to 40 GHz. Parylene is used as the structure material and photoresist as the sacrificial layer. The mechanical structure is of a bridge type. The measured insertion loss is from -0.1 dB to -0.28 dB where the fre

A highly miniaturized 2.4 GHz BluetoothTM radio utilizing an advanced system-in-package technology Pascal Philippe, Atila Oruk Abstract - A miniature Bluetooth radio, fully integrated in a 5x5 mm2 32-pin plastic package, is presented. The radio utilizes the novel Philips RF silicon-based System in Package technology (sbSiP) that enables the integration of all the passive components external to the

110-GHz high-gain flip-chip InP HEMT amplifier with resin encapsulation on an organic substrate Satoshi Masuda, Hidehiko Kira', Tatsuya Hirose Abstract -- A high-gain amplifier monolithic microwave integrated circuit (MMIC) was developed using InP HEMT technology with inverted microstrip lines. The six-stage amplifier demonstrated a gain of 30 dB at 110 GHz. We also fabricated a resin-sealed flip-

Ronald E. Reedy1, Massimo Claudio Comparini2 1 Peregrine Semiconductor, 6450 Carroll Park Dr. San Diego, CA USA, 858.731-9480 2 Alenia Spazio, Roma, Italy Abstract ­ Wireless systems of all types, from mobile phones to satellites have developed based on a combination of integrated circuits (IC) and multi chip modules (MCM). Digital sections of these systems have benefited from increasing levels of

Advanced Multi Chip Module Solutions for RF and Digital Space Applications: Status and Perspective M.C.Comparini, U. Di Marcantonio, M.Feudale, V.Piloni, A.Suriani Alenia Spazio, Via Saccomuro 24, 00131, Roma Abstract -- The evolution of space modules and equipment hardware is strictly related to the progress of enabling technologies in terms of available high reliable processes and devices, adva

3D packaging for space application : imagination and reality Philippe Monfraix, Claude Drevon, Chloé Schaffauser, Mathieu Paillard, Olivier Vendier, Jean-Louis Cazaux ALCATEL ALENIA SPACE FRANCE, 26 avenue J.F. Champollion, 31037 Toulouse CEDEX, France Philippe.Monfraix-space.alcatel.fr Abstract -- This paper describes the ALCATEL experience on the design, manufacturing and measurement of microwa

Enabling RFCMOS solutions for emerging advanced applications John J. Pekarik, Douglas D. Coolbaugh, Peter E. Cottrell, Sebastian M. Csutak, David R. Greenberg, Basanth Jagannathan, David I. Sanderson, Lawrence Wagner, Joseph Walko, Xudong Wang, Josef Watts IBM Semiconductor Research and Development Center, Essex Junction, VT 05452 USA (802) 769-9812 Abstract -- The enablement of advanced RF applic