Proceedings of the 13th European Microwave Integrated Circuits Conference Comparison of S-band Analog and Dual-Input Digital Doherty Power Amplifiers Anna Piacibello# , Marco Pirola# , Vittorio Camarchia# , Chiara Ramella# , Roberto Quaglia+ , Xinyu Zhou* , Wing-Shing Chan* # Politecnico di Torino, Torino, Italy University, Cardiff, Wales, UK * City University of Hong Kong, HK anna.piacibello-po

Proceedings of the 13th European Microwave Integrated Circuits Conference Frequency Domain-Based Method for a Two-Port Nonlinear Quasi-Static Model Extraction from LargeSignal Waveforms Sergio Pérez-Parras, Teresa M. Martín-Guerrero, J.D. Baños-Polglase, Carlos Camacho-Peñalosa Departamento de Ingeniería de Comunicaciones, E.T.S. Ingeniería de Telecomunicación Universidad de Málaga, Andalucía Tec

Proceedings of the 13th European Microwave Integrated Circuits Conference Characterization of Bond Wire Interconnects in QFN Packages Qun Xiao MACOM Technology Solutions, Inc., Lowell, MA, USA Qun.Xiao-macomtech.com Abstract ? This paper discusses models and measurements of bond wire interconnects in Quad-Flat No-lead (QFN) packages. A bond wire interconnect between a 3 mm, 14-lead QFN lead fram

Proceedings of the 13th European Microwave Integrated Circuits Conference New Compact Antenna Diversity with a Fully Integrated Microwave Circuit for Automotive Satellite Radio Reception Simon Senega#, Jürgen Röber*, Ali Nassar#, Robert Weigel*, Christian Heuer?, Stefan Lindenmeier# Institute of High Frequency Technology and Mobile Communication, Universität der Bundeswehr München, Germany * Inst

Proceedings of the 13th European Microwave Integrated Circuits Conference Three Stage 5-18.5 GHz High Gain and High Power Amplifier based on 0.15 µm GaN technology M. Dinari, G. Mouginot, E. Byk, V. Brunel, C. Chang, L. Brunel , M. Camiade United Monolithic Semiconductors (UMS), 10 avenue du Quebec, 91140 Villebon sur Yvette, France An efficient solution is presented in this paper, the chosen to

Proceedings of the 13th European Microwave Integrated Circuits Conference A Highly Integrated Transceiver for Mobile Satellite Services User Terminals Incorporating Dual Receivers for Satellite Handover and Digital PreDistortion for PA Linearization on 0.18?m CMOS Cormac O?Sullivan1, Chris Campbell1, Maeve Colbert1, Darren Collins1, Patrick Kelleher1, Krzystof Niewiadomski2, Francesco Pini3, Jan

Proceedings of the 13th European Microwave Integrated Circuits Conference Characterization of Flex to Printed Circuit Board Interconnections using Insertion Connectors Ch. Person #1, D NGuyen #2, J.Ph Coupez #3, Ph Minard*4, D Lohine Tong*5, P. Borel §6, D. Izoard §7 # LabSTICC, IMT Atlantique, France Technicolor Connected Home, France § Centre Technique du Papier, France {1 christian.person, 2

Proceedings of the 13th European Microwave Integrated Circuits Conference Design and Implementation of an Encapsulated GaN X-band Power Ampli?er Family Onur Memioglu#1 , Alper Karakuzulu#1 , Adnan Gundel# , Fatih Kocer* , Ozlem Aydin Civi# # Department of Electrical and Electronics Engineering, Middle East Technical University, Turkey * Analog Devices Inc., Chelmsford, MA, USA 1 { onur.memioglu,

Proceedings of the 13th European Microwave Integrated Circuits Conference A Procedure for GaN HEMT Charge Functions Extraction from Multi-Bias S-Parameters Gian Piero Gibiino#,* , Alberto Santarelli# , and Fabio Filicori# # DEI ?G. Marconi?, University of Bologna, Italy * gianpiero.gibiino-unibo.it always zero, i.e., charge is conserved along a closed loop in the voltage domain [7]. This typica

Proceedings of the 13th European Microwave Integrated Circuits Conference 4 ? 18 GHz AlGaN/GaN Based Distributed Power Amplifier MMIC B. Bunz, H. Sledzik, P. Schuh and M. Oppermann Hensoldt Sensors GmbH, Ulm, Germany bernd.bunz-hensoldt.net Abstract ? A broadband power amplifier MMIC based on AlGaN/GaN HEMT technology from 4 GHz to 18 GHz was designed, fabricated and measured. Potential applicati