Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions
Thierry Le Gouguec, Najib Mahdi, Stéphane Cadiou, Cédric Quendo, Erich Schlaffer, Walter Pessl, Alain Lefevre
The recent developments in electronic cards such as the network equipment are characterized by the miniaturization of the board size and the increasing complexity of the layout. Because of these requirements, multi-layered printed circuit boards are commonly used and vias connecting signal lines on different layers, or integrated circuit devices to power and ground planes, are frequently used and