Analytic description, measurements, and modeling of 3D-embedded silicon inductance for High-Performance Hybrid Systems Applications
Philippe Descamps, Olivier Tesson, Magali Duplessis, Daniel Pasquet, Hugues Murray
In this paper, the design and the measurements of three-dimensional through silicon vias (TSVs) based-integrated solenoids embedded within high-resistive silicon is presented. Prior to silicon implementation, a rigorous theoretical analysis is proposed to put in obviousness the advantages of using such coil architecture for L and S band applications. This analysis, demonstrates a clear reduction o