Proceedings of the 5th European Microwave Integrated Circuits Conference Theoretical and Experimental Comparison of Class F vs.Class F-1 PAs Elisa Cipriani, Paolo Colantonio, Franco Giannini, Rocco Giofrè Electronic Engineering .Department, University of Roma Tor Vergata Via del Politecnico 1, 00133 Roma Italy elisa.cipriani-uniroma2.it Abstract-- In this contribution, a comparison between Class

Proceedings of the 5th European Microwave Integrated Circuits Conference Thermal and trapping phenomena assessment on AlGaN/GaN microwave power transistor Guillaume Mouginot#*1, Raphaël Sommet#, Raymond Quéré#, Zineb Ouarch*, Sylvain Heckmann*, Marc Camiade* XLIM ­ UMR CNRS 6172 ­ Université de Limoges 7, rue Jules Vallès, 19100 Brive-la-Gaillarde, France 1 # guillaume.mouginot-ums-gaas.com Un

Proceedings of the 5th European Microwave Integrated Circuits Conference GaN based power amplifiers for broadband applications from 2 GHz to 6 GHz H. Sledzik#, R. Reber#, B. Bunz#, P. Schuh#, M. Oppermann# M. Mußer*, M. Seelmann-Eggebert* and R. Quay* EADS Deutschland GmbH, Defence Electronics, Wörthstr. 85, 89077 Ulm, Germany *Fraunhofer Institute of Applied Solid-State Physics, Tullastr. 72, 79

Proceedings of the 5th European Microwave Integrated Circuits Conference 107-112 Gbit/s Fully Integrated CDR/1:2 DEMUX Using InP-Based DHBTs R. E. Makon#1, R. Driad#, C. Schubert*, J. Fischer*, R. Lösch#, H. Walcher#, J. Rosenzweig#, M. Schlechtweg#, and O. Ambacher# # Fraunhofer Institute for Applied Solid State Physics IAF, Tullastrasse 72, D-79108 Freiburg, Germany 1 robert.makon-iaf.fraunhof

Proceedings of the 5th European Microwave Integrated Circuits Conference RF Passive Components on a Low Resistivity Si Substrate with an ABF Isolation Layer Dongsu Kim1, Dong Ho Kim, Jong Min Yook, Jong In Ryu, Se-Hoon Park, and Jun Chul Kim Packaging Research Centre, Korea Electronics Technology Institute, 68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-816, Korea 1 kimds-keti.re.kr A

Proceedings of the 5th European Microwave Integrated Circuits Conference A System-on-Package Module by Fully Embedding Chip Components in Organic Substrate Jong-In Ryu#,*1, Dongsu Kim#2, Jun Chul Kim#3, Hyeongdong Kim*4, and Jong Chul Park#5 System Package Research Center, Korea Electronics Technology Institute #68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-816, South Korea 1 # acery

Proceedings of the 5th European Microwave Integrated Circuits Conference A dual-tapped microstrip resonator VCO Masaomi Tsuru, Kazuhiro Nishida, Kenji Kawakami, Daisuke Yamaguchi, Masahiko Komaki, Morishige Hieda, Ryoji Hayashi, Yoshihito Hirano Mitsubishi Electric Corporation, 5-1-1 Ofuna, Kamakura, Kanagawa, 247-8501, JAPAN Tsuru.Masaomi-eb.MitsubishiElectric.co.jp Abstract--A high loaded Q res

Proceedings of the 5th European Microwave Integrated Circuits Conference A Varactorless VCO with 15% Continuous Frequency Tuning Range and 0.2 dB Output Power Variation Ying Chen#1, Koen Mouthaan#, Marcel Geurts* # Department of Electrical and Computer Engineering, National University of Singapore, Singapore 1 ying.chen-nus.edu.sg * NXP Semiconductors, Nijmegen, the Netherlands Abstract-- An

Proceedings of the 5th European Microwave Integrated Circuits Conference Terahertz three-dimensional plasma resonances in InGaAs diodes: a hydrodynamic study Pierre Ziad´ # , Christophe Palermo #1 , Hugues Marinchio # , Thibault Laurent # , Giulio Sabatini # , e Philippe Nouvel # , Ziad Kallassy , Luca Varani # # Institut d'Electronique du Sud ­ UMR CNRS­UM2 5214 c.c.084, Universit´ Montpellier

Proceedings of the 5th European Microwave Integrated Circuits Conference A Low Phase-Noise SiGe Colpitts VCO with Wide Tuning Range for UWB Applications Alexander Esswein #1 , Gunther Dehm-Andone #2 , Robert Weigel #3 , Anna Aleksieieva 4 , Martin Vossiek 5 # Friedrich-Alexander University of Erlangen-Nuremberg, Institute for Electronics Engineering Cauerstr. 9, 91058 Erlangen, Germany 2 esswei