The Hybrid TLM-MM approach for Simulation of MMICs Dzianis Lukashevich, Borys Broido, Martin Pfost and Peter Russer Institut f¨ r Hochfrequenztechnik, Technische Universit¨ t M¨ nchen u a u Arcisstr. 21, D-80333 M¨ nchen, Germany, lukashevich-ei.tum.de u Infineon Technologies AG, martin.pfost-infineon.com Abstract-- The design of microwave monolithic integrated circuits (MMICs) requires the exac

A hybridization technique for MLFMM for a large class of cavity backed aperture scattering problems Arthur Enneking1, Jan Ritter2 , Rainer Bunger2 1 A. Enneking, Microwave Software Development, Aschaffenburger Str. 13, 28215 Bremen, Germany, arthur.enneking.msd-m.eads.net 2 EADS Deutschland GmbH, Military Aircraft, H¨ nefeldstraße 1­5, u 28199 Bremen, Germany, jan.ritter-m.eads.net, fax +49 421 5

A Hybrid FDTD/Quasistatic Technique for the Accurate Modeling of Complex Integrated Structures Including Effects of Lossy Metals E.T.K. Dalton1, M. Kunze2, W. Heinrich2, M.M. Tentzeris1 1 Georgia Institute of Technology, Department of Electrical and Computer Engineering, 777 Atlantic Dr, Atlanta GA 30332, USA 2 Ferdinand-Braun-Institut für Höchfrequenztechnik (FBH), D-12489 Berlin, Germany inaccu

E-BAND CPW RING HYBRID USING AN OVERLAPPED COUPLING STRUCTURE Jong-Sik Lim1, Sunyoung Jeong1, Young-Taek Lee1, Sungwon Kim1, Kwang-Seok Seo1, and Sangwook Nam1 1 School of Electrical Engineering and Computer Science, Seoul National University, Seoul, Rep. Of Korea Applied Electromagnetics Lab., Institute of New Media and Communications, Seoul National University, San 56-1, Shilim-Dong, Kwanak-Gu

Novel 90° power-coupling concept based on broadside-coupled coplanar transmission lines for new VHF power transmitter family Ingo Schmale TELEFUNKEN SenderSysteme Berlin AG Mertensstr. 63, 13587 Berlin, Germany Phone: +49 / 30 / 339 78 ­ 334, Email: i.schmale-tsb-ag.de Abstract -- Broadside-coupled coplanar transmission lines [1] are employed as 90° power combiners. By optimising the geometry, ti

A New Type of Reduced Size Stub in Asymmetric Coplanar Stripline Khelifa Hettak1, Cornelius J. Verver1, Malcolm G. Stubbs1, Gilbert A. Morin2 1 Communications Research Centre Canada, 3701 Carling Avenue, Ottawa, Canada, 1-613-998-5216 2 Defence R & D Canada, 3710 Carling Avenue, Ottawa, Canada, 1-613-998-1092 Abstract -- This paper introduces a new family of reduced size asymmetric coplanar stri

Microstrip filter and power divider with improved out-of-band rejection for a Ku­band input multiplexer Sergio Llorente­Romano , Alejandro Garc´a­Lamp´ rez , Magdalena Salazar­Palma , i e a u Ana Isabel Daganzo­Eusebio , Juan Sebasti´ n Galaz­Villasante , Manuel Jes´ s Padilla­Cruz Dpto. Se~ ales, Sistemas y Radiocomunicaciones, Universidad Polit´ cnica de Madrid, n e ETSI Telecomunicaci´ n, Ci

Efficient Analysis of Printed Circuits by the MoM/BI-RME Method M. Repossi, P. Arcioni, M. Bozzi, M. Bressan, and L. Perregrini Department of Electronics, University of Pavia, Pavia, Italy repossi-ele.unipv.it, arcioni-unipv.it, bozzi-unipv.it, bressan-unipv.it, perregrini-unipv.it Abstract-- This paper presents an efficient technique for the analysis of printed circuits with arbitrarily shaped me

System-on-Package (SOP) Architectures for compact and low cost RF Front-end modules S. Pinel, K. Lim, R. G. DeJean, L. Li, C-H.Lee, M. Maeng, M.F. Davis, M. Tentzeris & J. Laskar. Packaging Research center, Yamacraw Design Center, School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta GA 30332-0269 USA Fax:(404) 894-5028, Email; pinel-ece.gatech.edu Abstract - This

Characterisation, Modelling and Design of Bond-Wire Interconnects for Chip-Package Co-Design Arun Chandrasekhar1, Serguei Stoukatch1, Steven Brebels1, Jayaprakash Balachandran1, Eric Beyne1, Walter De Raedt1, Bart Nauwelaers2 and Anindya Poddar3 MCP-MaRS, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium. Phone: +32 16 288228 E-mail: achandra-imec.be 2 Dept. ESAT, K. U. Leuven, Kasteelpark Arenberg 1